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Job Title: Wafer Fabrication and Epitaxy Process Engineer
Division/Department: CCO_Technical Development
Location: Tianjin
Your Responsibilities:
1. Optimize epitaxy process techniques and wafer fabrication process of Power
Semiconductor chips using advanced materials and equipment to increase the
yield.
2. Work closely with the research and development team to evaluate and
implement innovative manufacturing techniques to improve chip yield,
performance and efficiency.
3. Monitor and improve the epitaxy process of suppliers by adjusting key
parameters such as temperature, gas flow, and pressure to achieve desired
results.
4. Collaborate with cross-functional teams to troubleshoot and resolve issues
related to chip fabrication and epitaxy process.
5. Assist in the development and implementation of quality control and
assurance procedures to ensure that products meet or exceed industry standards.
6. Provide technical support and training to other team members as needed to
ensure a smooth and efficient manufacturing process.
7. Stay current with emerging technologies and industry trends to identify
opportunities for process improvements and new product development.
Our Requirements:
1.Bachelor's degree in Electrical Engineering, Materials Science, Chemical
Engineering, or related field.
2. Minimum 5 years of experience in semiconductor chip fabrication and/or
epitaxy process engineering.
3. Hands-on experience with advanced materials and equipment used in the power
semiconductor industry.
4. Strong understanding of semiconductor physics, materials science, and
fabrication techniques.
5. Ability to work effectively in a cross-functional team environment and
collaborate with other departments.
6. Strong problem-solving and analytical skills, with the ability to
troubleshoot and resolve complex issues.
7. Excellent communication skills, both written and verbal, with the ability
to effectively communicate technical concepts to both technical and
non-technical audiences.
8. Proficiency in using computer software tools and applications related to
chip fabrication and epitaxy process engineering.